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Home > Rogers PCB > Rogers RO3006 High Frequency Printed Circuit Board 2-Layer Rogers 3006 10mil PCB DK6.15 DF 0.002 Microwave Gold PCB
Rogers RO3006 High Frequency Printed Circuit Board 2-Layer Rogers 3006 10mil PCB DK6.15 DF 0.002 Microwave Gold PCB

(Note: Printed Circuit Boards (PCBs) are custom-made products. The images and specifications provided are for reference only.)


Overview of Rogers RO3006 High Frequency Circuit Materials

The Rogers RO3006 high frequency circuit materials are crafted from ceramic-filled PTFE composites designed for commercial microwave and RF applications. These materials provide exceptional electrical and mechanical stability at competitive prices. Their consistent mechanical properties enable designers to create multi-layer board designs without facing issues of warpage or reliability.


RO3006 materials have a coefficient of thermal expansion (CTE) of 17 ppm/℃ in both the X and Y axes. This expansion coefficient closely matches that of copper, ensuring excellent dimensional stability, with typical etch shrinkage after etching and baking of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, which guarantees outstanding reliability for plated through-holes, even in harsh environments.


Typical Applications

  1. 1.Automotive radar systems
  2. 2.Cellular telecommunications networks
  3. 3.Datalink over cable systems
  4. 4.Direct broadcast satellite technology
  5. 5.Global Positioning System (GPS) antennas
  6. 6.Patch antennas for wireless communication
  7. 7.Power amplifiers and antennas
  8. 8.Power backplanes
  9. 9.Remote meter reading devices


PCB Capability (RO3006)

PCB Material:

Ceramic-filled PTFE Composites

Designation:

RO3006

Dielectric constant:

6.15

Dissipation Factor

0.002 10GHz

Layer count:

Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB

Copper weight:

1oz (35µm), 2oz (70µm)

Laminate thickness:

5mil(0.127mm), 10mil(0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil (1.524mm  )

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, ENEPIG,  Pure gold plated etc..


PCB Specifications

Click to expand/collapse the table

Rogers RO3006 10mil 0.254mm High Frequency PCB DK6.15 RF PCB Board for Global Positioning Satellite Antennas

PCB SIZE

152 x 152mm=1PCS

BOARD TYPE

Double sided PCB

Number of Layers

2 layers

Surface Mount Components

YES

Through Hole Components

YES

LAYER STACKUP

copper ------- 18um(0.5 oz)+plate TOP layer

RO3006 0.254mm

copper ------- 18um(0.5 oz) + plate  BOT Layer

TECHNOLOGY

 

Minimum Trace and Space:

14 mil / 14 mil

Minimum / Maximum Holes:

0.4 mm / 4.0 mm

Number of Different Holes:

1

Number of Drill Holes:

1

Number of Milled Slots:

0

Number of Internal Cutouts:

0

Impedance Control:

no

Number of Gold finger:

0

BOARD MATERIAL

 

Glass Epoxy:

RO3006 0.254mm

Final foil external:

1 oz

Final foil internal:

N/A

Final height of PCB:

0.3 mm ±0.1mm

PLATING AND COATING

 

Surface Finish

Immersion Gold

Solder Mask Apply To:

N/A

Solder Mask Color:

N/A

Solder Mask Type:

N/A

CONTOUR/CUTTING

Routing

MARKING

 

Side of Component Legend

N/A

Colour of Component Legend

N/A

Manufacturer Name or Logo:

N/A

VIA

Plated through hole(PTH), minimum size 0.4mm.

FLAMIBILITY RATING

UL 94-V0 Approval MIN.

DIMENSION TOLERANCE

 

Outline dimension:  

0.0059"

Board plating:

0.0029"

Drill tolerance:

0.002"

TEST

100% Electrical Test prior shipment

TYPE OF ARTWORK TO BE SUPPLIED

email file, Gerber RS-274-X, PCBDOC etc

SERVICE AREA

Worldwide, Globally.



Data Sheet of Rogers 3006 (RO3006)

Click to expand/collapse the table

RO3006 Typical Value

Property

RO3006

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

6.15±0.05

Z

 

10 GHz/23℃

IPC-TM-650 2.5.5.5 Clamped Stripline

Dielectric Constant,εDesign

6.5

Z

 

8GHz to 40 GHz

Differential Phase Length Method

Dissipation Factor,tanδ

0.002

Z

 

10 GHz/23℃

IPC-TM-650 2.5.5.5

Thermal Coefficient of ε

-262

Z

ppm/℃

10 GHz -50℃to 150℃

IPC-TM-650 2.5.5.5

Dimensional Stability

0.27
0.15

X
Y

mm/m

COND A

IPC-TM-650 2.2.4

Volume Resistivity

105

 

MΩ.cm

COND A

IPC 2.5.17.1

Surface Resistivity

105

 

MΩ

COND A

IPC 2.5.17.1

Tensile Modulus

1498
1293

X
Y

MPa

23℃

ASTM D 638

Moisture Absorption

0.02

 

%

D48/50

IPC-TM-650 2.6.2.1

Specific Heat

0.86

 

j/g/k

 

Calculated

Thermal Conductivity

0.79

 

W/M/K

50℃

ASTM D 5470

Coefficient of Thermal Expansion
(-55 to 288℃)

17
17
24

X
Y
Z

ppm/℃

23℃/50% RH

IPC-TM-650 2.4.4.1

Td

500

 

℃ TGA

 

ASTM D 3850

Density

2.6

 

gm/cm3

23℃

ASTM D 792

Copper Peel Stength

7.1

 

Ib/in.

1oz,EDC After Solder Float

IPC-TM 2.4.8

Flammability

V-0

 

 

 

UL 94

Lead-free Process Compatible

Yes

 

 

 



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